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| Packaging Engineer NC Open (J#30938) Title: Packaging Engineer Company: Nitronex Corporation Description: Mission Statement: Develop new packages and assembly processes to release 5 new RF products over the next 12 months, reduce packaging and assembly cost by 50% in 12 months, and support manufacturing as needed. Desired Outcomes: Develop new and modified packages to meet new product development schedules 100% on-time Implement strategy to cut packaging and assembly cost by 50% within 12 months Reduce thermal resistance in package 35% in 12 months Support internal assembly lab to ensure assembly requests are completed in less than 2 days average Work with assembly suppliers to transfer new products into production and develop new assembly processes Support operations to resolve technical packaging issues as needed Core Competencies: Solid understanding of assembly equipment, processes, and packaging materials - including AuSi and AuSn eutectic die attach, epoxy die attach, wedge and ball bonding, transfer molding, epoxy lid seal, and lasermarking Proactive and self-motivated to accomplish tasks without being micromanaged Hands-on with good mechanical skills Analytically-minded and good with software tools to manage work, run analysis, create reports, etc. Understanding of statistical techniques to plan and execute experiments to solve problems and improve processes Able to follow through on commitments without being reminded Excellent communication and comfortable working with cross-functional teams Able to manage multiple projects and tasks continuously Pays attention to detail to minimize errors, manage risks, and create first-success solutions Minimum 3-5 years experience in semiconductor packaging BS in mechanical engineering, manufacturing engineering, materials science, or comparable RF packaging experience a plus Disclaimer: Local Candidates Only More... | |||
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